The outline of bump bond process steps. (1) deposition of field metal

Hans ANDERSSON, Principal Research Engineer

The outline of bump bond process steps. (1) deposition of field metal

Hans ANDERSSON, Principal Research Engineer

Left) A 64 x 64 pixel GaAs array produced to qualify the bump bonding

Left) X-ray image of a line pair rule taken using an un-collimated

Left) A 64 x 64 pixel GaAs array produced to qualify the bump bonding

A. Peacock's research works European Space Agency, Paris (ESA) and other places

PDF) GaAs array fabrication

Left) X-ray image of a line pair rule taken using an un-collimated

Left) X-ray image of a line pair rule taken using an un-collimated

The outline of bump bond process steps. (1) deposition of field metal

Hans ANDERSSON, Principal Research Engineer

The outline of bump bond process steps. (1) deposition of field metal

A. Peacock's research works European Space Agency, Paris (ESA) and other places

PDF) GaAs array fabrication